Analysis & Design
| Analysis & Design Technology | Methods & Equipment Used | |
|---|---|---|
| General Analysis | General Dimensions | 3D Measuring Machines (Contact / Non-contact), Surface Roughness & Profile Measuring Instruments |
| Electrical Properties | LCR meter, 4-point probe, Withstand Voltage Tester, Insulation Resistance Tester | |
| Internal Defects & Structure | Ultrasonic Scanner | |
| Precision Analysis | Flatness | ZYGO Laser Interferometer |
| Surface | Confocal Laser Scanning Microscope (KEYENCE) | |
| Material Properties | SEM Imaging, EDS, XRF, Density Meter, Hardness Tester | |
| Material Color | Color Difference Meter | |
| Thermal Analysis and Temperature Simulation Design & Testing | IR Camera, TC WAFER | |
| Design and Testing for Vacuum Chuck Performance Optimization |
Design for Warped Wafers Flatness Optimization Pattern Mounting Deformation Minimization Method |
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